Title:
PRESS FIT SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021197492
Kind Code:
A
Abstract:
To provide a press fit semiconductor device that is mounted by press fitting, and can be mounted with high connection reliability while reducing the press stress on the semiconductor chip during press-fitting.SOLUTION: A press fit semiconductor device mounted by press fitting comprises a power semiconductor chip, a disk on which the power semiconductor chip is bonded to the surface and on which the power semiconductor chip is placed, and a tapered portion on the periphery of the disk at an angle in the range of 70° or more and 80° or less with respect to the press-fit direction.SELECTED DRAWING: Figure 2
Inventors:
SHINYA SHOTARO
TAKEDA TSUBASA
TAKEDA TSUBASA
Application Number:
JP2020104285A
Publication Date:
December 27, 2021
Filing Date:
June 17, 2020
Export Citation:
Assignee:
HITACHI POWER SEMICONDUCTOR DEVICE LTD
International Classes:
H01L23/48; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Polaire Patent Business Corporation