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Title:
PRESSER PLATE FOR PACKING ETCHED COMPONENT AND METHOD OF PACKING ETCHED COMPONENT USING THE SAME
Document Type and Number:
Japanese Patent JP2003112770
Kind Code:
A
Abstract:

To suppress generation of foreign matters due to abrasion, impact or the like during handling such as transportation and storage and generation of foreign matters by friction of a polypropylene band, to prevent a peripheral portion of an etched component from bending, and to reduce failures of the component by using a presser plate for packing the etched component.

Two plastic corrugated board sheets are stuck, and rib directions of the two sheets 54a and 54b are orthogonal to each other. The component is tied with a band and packed with a lower presser plate and an upper presser plate disposed so that a rib direction of an upper layer 61a of the lower presser plate is in parallel to a rib direction of an upper layer 62a of the upper presser plate.


Inventors:
Soga, Tomoaki
Hashimoto, Masakazu
Kuno, Hisashi
Application Number:
JP2001000306093
Publication Date:
April 18, 2003
Filing Date:
October 02, 2001
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD
International Classes:
B65B27/08; B65D71/04; B65D85/00; B65D85/86; B65B27/08; B65D71/02; B65D85/00; B65D85/86; (IPC1-7): B65D71/04; B65B27/08; B65D85/00; B65D85/86



 
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