To provide a pressure bonding device with pressure bonding test function, which can measure and manage the degree of pressure bonding with high accuracy.

The pressure bonding device is provided with an air cylinder and a die section equipped with a bottom tool 114 and a top force 115 and placed above the air cylinder. The bottom tool is installed such that it is pushed upward by the air cylinder against the top force and a sensor plate is fixed onto the bottom tool. In addition the device is provided with a contact type sensor in parallel with the die and a pressure bonding test equipment 20 for measuring the position of a terminal of the contact type sensor moved with its end in contact with the sensor plate as a measured value.