Title:
ハイブリッド圧力アキュムレータを備えた圧力接触連結型パワー半導体モジュール
Document Type and Number:
Japanese Patent JP5695892
Kind Code:
B2
Abstract:
The module (1) has load connection elements (40, 42, 44) formed as a metal mold body with pressure-transmitting sections (402, 422, 442) and contact bases (400, 420, 440). The pressure-transmitting sections are arranged approximately parallel to a substrate surface and at a distance from the substrate surface. The bases are passed from the pressure-transmitting sections to a substrate (5). Pressure is transmitted from a pressure element (72) to the pressure-transmitting sections by a hybrid, resilient plastic mold body (80a) with partial regions (800a, 802a) of different spring constants.
Inventors:
Marco Lederer
Liner pop
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Application Number:
JP2010268277A
Publication Date:
April 08, 2015
Filing Date:
December 01, 2010
Export Citation:
Assignee:
SEMIKRON Elektronik GmbH & Co.KG
International Classes:
H01L25/07; H01L25/18
Domestic Patent References:
| JP2007221127A | ||||
| JP2006124499A | ||||
| JP2007221128A | ||||
| JP2007335858A | ||||
| JP2000223180A |
Attorney, Agent or Firm:
Fujita Akira
Hideki Imai
Kanazawa Mitsuhiro
Hideki Imai
Kanazawa Mitsuhiro