Title:
均圧装置及びそれを備えた圧着機
Document Type and Number:
Japanese Patent JP7102467
Kind Code:
B2
Abstract:
An equal pressure device can equally pressurize a laminated PCB. The equal pressure device is configured such that a liquid space (400) formed by a press cavity (422) and a chamber (411) is sealed when a plurality of press plates (2) are propelled by a driving device (3). When a fluid is filled in the liquid space (400), a liquid pressure value received by each of pistons (423) is the same, so press pressure to the nearest press plate (2) by each of the pistons (423) is the same. Accordingly, the equal pressure device can obtain an equal pressure effect.
Inventors:
岡▲さき▼ 靜明
Application Number:
JP2020125058A
Publication Date:
July 19, 2022
Filing Date:
July 22, 2020
Export Citation:
Assignee:
岡▲さき▼ 靜明
International Classes:
B30B1/32; B30B5/02
Domestic Patent References:
| JP2016168624A | ||||
| JP2012035324A | ||||
| JP2005066609A | ||||
| JP4339595A | ||||
| JP8224700A |
Foreign References:
| US20080196474 | ||||
| US4576092 | ||||
| CN101022702A |
Attorney, Agent or Firm:
Masatoshi Kurata
Tadashi Inoue
Shigeru Iino
Naoyuki Yato
Ikuji Otaku
Naoki Kono
Sanae Kaneko
Tadashi Inoue
Shigeru Iino
Naoyuki Yato
Ikuji Otaku
Naoki Kono
Sanae Kaneko