Title:
PRESSURE FOOT FOR SUBSTRATE PROCESSING MACHINE AND PRINTED WIRING BOARD DRILLING MACHINE EQUIPPED WITH THE SAME
Document Type and Number:
Japanese Patent JP2004017199
Kind Code:
A
Abstract:
To provide a pressure foot for a substrate processing machine and a printed wiring board drilling machine preventing tilt and lift of a work and breakage of a drill even if thickness of the printed wiring board is uneven.
A substrate pressing bush is provided with a mechanism for adjusting tilt of the work by fitting a spherical bearing 10 in a through hole provided on a lower end of the pressure foot for the substrate processing machine and attaching the substrate pressing bush 4 on a part of the spherical bearing.
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Inventors:
NAKAMURA SHOWA
Application Number:
JP2002174177A
Publication Date:
January 22, 2004
Filing Date:
June 14, 2002
Export Citation:
Assignee:
NEC TOPPAN CIRCUIT SOLUTIONS T
International Classes:
B23B47/28; B23B41/00; H05K3/00; (IPC1-7): B23B47/28; B23B41/00; H05K3/00
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