To provide a pressure-reduced heating apparatus which manages the real temperature of an object over the whole process in a process to heat the object under reduced pressure, and can perform optimum heating on the object based on the real temperature; and to provide its heating method, and a manufacturing method of electronic products in which solder joints are formed by using the apparatus and the method.
The object is heated to a preheating temperature (time t0 to time t1) while the adjustment of the setting of the emissivity of a non-contact type temperature measurement section and the temperature control of the object are performed by a measurement value of a contact type temperature measurement section in an atmospheric-pressure reducing gas atmosphere. Pressure is reduced (time t1 to time t2). The object is further heated to a heat treatment temperature (time t2 to time t5) under reduced pressure while the temperature control of the object is performed using the measurement value of the non-contact type temperature measurement section whose emissivity setting has been adjusted in the preheating process to the preheating temperature. The pressure of the atmosphere is returned to atmospheric pressure (time t5 to time t6) while the heat treatment temperature of the object is held. The temperature of the object is decreased under the atmospheric pressure (time t6 to time t7).
MATSUURA MASAYA
KUBOTA TOMOYUKI
TSURUTA MASAYA
HIRATA SPINNING
| JP2005205418A | 2005-08-04 | |||
| JP2007246938A | 2007-09-27 | |||
| JP2000218151A | 2000-08-08 |
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