Title:
PRESSURE SENSING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2017032571
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensing semiconductor device having resistance to applied pressure and capable of detecting pressure reliably and efficiently.SOLUTION: A first electrode and a second electrode are arranged facing each other via a prescribed distance and housed in a package member, and the displacement of the first electrode that corresponds to pressure applied to a core extending from one end of the body of a position indicator causes static capacitance between the first electrode and the second electrode to change. An elastic member is disposed on a side of the first electrode that is opposite the side facing the second electrode. A recess is formed in the package member so as to cause the elastic member disposed on a side of the first electrode that is opposite the side facing the second electrode to go to an open state. The pressure applied to the core via this recess is propagated to the first electrode via the elastic member.SELECTED DRAWING: Figure 1
Inventors:
HORIE TOSHIHIKO
TAKIGUCHI HIDETAKA
TAKIGUCHI HIDETAKA
Application Number:
JP2016174205A
Publication Date:
February 09, 2017
Filing Date:
September 07, 2016
Export Citation:
Assignee:
WACOM CO LTD
International Classes:
G01L1/14; B81B3/00; G01L5/00; H01L29/84
Domestic Patent References:
| JPH0637924U | 1994-05-20 | |||
| JPS6092670A | 1985-05-24 | |||
| JPH0637924U | 1994-05-20 | |||
| JPS6092670A | 1985-05-24 |
Attorney, Agent or Firm:
Masami Sato
Tadashi Maruyama
Tadashi Maruyama
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