PURPOSE: To obtain a pressure-sensitive adhesion composition having excellent adhesive power which can be reduced by irradiation with ultraviolet rays, made of a saturated copolyester resin, an ultraviolet-crosslinking acrylate, and a polymerization initiator as principal components.

CONSTITUTION: Two or more saturated dibasic carboxylic acids (e.g., terephthalic acid) and saturated dihydric alcohols (e.g., ethylene glycol) are made to undergo polycondensation to prepare a saturated copolyester resin. An objective pressure-sensitive adhesive composition is obtained by mixing this copolyester resin with an ultraviolet-crosslinking acrylate (e.g., trimethylolpropane triacrylate) and a polymerization initiator (e.g., benzoin methyl ether) as principal components. This composition has high initial adhesive power which decreases by irradiation with ultraviolet rays; hence it is suitable for use in the manufacture of a film for silicon wafer dicing.