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Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION HAVING ANAEROBIC CURABILITY
Document Type and Number:
Japanese Patent JPS6013868
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled composition having excellent curability and adhesivity, and suitable as a pressure-sensitive adhesive tape and prepreg, by adding a specific metallic compound to a pressure-sensitive adhesive composition containing a (meth)acryloyl-containing oligo(meth)acrylate, a rubbery polymer, etc.

CONSTITUTION: The objective composition can be produced by mixing (A) a (meth)acryloyl-containing oligo(meth)acrylate [e.g. epoxy-(meth)acrylate] with (B) a polymer which is rubbery at normal temperature [e.g. rubber having (meth)acryloyl group at the side chain], (C) a curing catalyst comprising an organic hydroperoxide, and (D) one or more compounds soluble in an organic solvent and selected from preferably organic Co, Fe, Mn and Mo compounds (e.g. an octylic acid salt). The amount of the component D is preferably 0.01ppmW1wt% based on the sum of the components A and B.

EFFECT: Uniform curability. Applicable also to a nonmetallic material.


Inventors:
TAKIYAMA EIICHIROU
MORITA KATSUHISA
ARAI MICHIAKI
Application Number:
JP12098183A
Publication Date:
January 24, 1985
Filing Date:
July 05, 1983
Export Citation:
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Assignee:
SHOWA HIGHPOLYMER
International Classes:
C08F20/00; C08F20/10; C08F20/34; C08F22/20; C08F22/22; C08F290/00; C08F299/00; C08F299/02; C09J4/02; (IPC1-7): C08F22/20
Domestic Patent References:
JPS4837443A1973-06-02
Attorney, Agent or Firm:
Kikuchi Seiichi