To provide a pressure-sensitive adhesive composition with which a surface protective film suppressing adhesion enhancing even under an extremely high temperature environment is produced.

The pressure-sensitive adhesive composition contains: a copolymer (I) with a structure represented by general formula [A-B]n (wherein A is a predetermined polymer block A mainly composed of an aromatic alkenyl compound unit, B is a predetermined random copolymer block polymer of an aromatic alkenyl-conjugated diene, and n is an integer of 1 to 3) or the hydrogen additive thereof; and a copolymer (II) with a structure represented by general formula A-B-A or general formula [A-B]x-Y (wherein x is an integer of 1 or more, and Y is a residue of a coupling agent) or the hydrogen additive thereof. The pressure-sensitive adhesive composition further contains 0.3 to 2 pts.wt. of at least one kind of fatty acid amide compound or a fatty acid amide composition including the compound as a principal ingredient, having an endothermic peak originating from the fatty acid amide compound or the fatty acid amide composition including the compound as the principal ingredient in the range of 25°C or more and lower than 40°C of differential scanning calorimetry, with respect to 100 pts.wt. of the total weight of the copolymer or the hydrogen additive thereof.