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Patent Searching and Data


Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JPS5853969
Kind Code:
A
Abstract:

PURPOSE: The titled composition having improved adhesiveness and cohesive force without causing reduction in water resistance and problems of environmental hygiene, comprising a bulk material obtained by continuous bulk polymerization of an acrylic monomer and a monomer for addition polymerization as a main component for adhesion.

CONSTITUTION: The titled composition comprising a bulk polymer as a main component of adhesive. The bulk polymer is obtained by polymerizing quickly a polymerization raw material having a viscosity of ≤10 poise at normal temperature, consisting essentially of an acrylic monomer capable of forming a polymer having adhesivity at normal temperature, by a radical polymerization initiator, to increase the viscosity of a polymer, polymerizing the polymer further to give an acrylic polymer having a given conversion, folowed by adding one or more ethylenic unsaturated monomers capable of providing a (co)polymer having a glass transition temperature of ≥273°K to the polymer by addition polymerization. The polymerization is carried out in a reactor having a structure to transfer continuously successively fed contents with renewing the surface of the contents, wherein the whole zone of transportation process is controlled at a given temperature by heating.


Inventors:
MATSUOKA NAOKI
IJICHI ICHIROU
SANO KENJI
YONEMORI YOSHITSUGU
Application Number:
JP15332281A
Publication Date:
March 30, 1983
Filing Date:
September 28, 1981
Export Citation:
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Assignee:
NITTO ELECTRIC IND CO
International Classes:
C08F2/00; C08F2/02; C09J133/04; (IPC1-7): C08F2/02; C09J3/14
Domestic Patent References:
JPS56153327A1981-11-27
Attorney, Agent or Firm:
Kunio Araimoto