PRESSURE-SENSITIVE ADHESIVE FILM CONTAINING ELASTIC MICROSPHERES - Minnesota Mining and Manufacturing Company

Title:

PRESSURE-SENSITIVE ADHESIVE FILM CONTAINING ELASTIC MICROSPHERES

Document Type and Number:

Japanese Patent JP3417596

Kind Code:

B2

Abstract:

PURPOSE: To provide a decorative pressure-sensitive adhesive film which can be easily stuck to an adhered without causing air inclusion between the pressure- sensitive adhesive of the film and the adherend by incorporating elastic microspheres into the adhesive.
CONSTITUTION: Pref., a film substrate (e.g. a polyvinyl chloride resin) having a pencil hardness (according to JIAS K 5400) of from H to 3B and a thickness of 50-150 μm is used. The microspheres (e.g. an acrylate/acrylic acid copolymer having a Tg lower than room temp.) used are hollow or porous, have an elastic modulus of 1×104-1×106 dyn/cm2 and a vol. average diameter of 100-300 μm, and are in the form of clusters each comprising 2-100 microspheres. The microspheres are incorporated in an amt. of 10-150 pts.wt. into 100 pts.wt. pressure-sensitive adhesive. A mixture of a pressure-sensitive adhesive (e.g. an acrylic resin) and the elastic microspheres is applied in a coating wt. of 25-100 g/m2 and then dried at a temp. of 80-100°C.

Inventors:

Hiroshi Matsuda

Application Number:

JP8057993A

Publication Date:

June 16, 2003

Filing Date:

April 07, 1993

Export Citation:

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