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Title:
PRESSURE-SENSITIVE ADHESIVE LAMINATED PRODUCT
Document Type and Number:
Japanese Patent JP2004359768
Kind Code:
A
Abstract:

To provide a pressure-sensitive adhesive laminated product which is easy to peel a release base material even after the heat treatment at extremely high temperatures (≥260°C).

The pressure-sensitive adhesive laminate has a pressure-sensitive adhesive layer on a release base material, and an initial peel force of the release base material and a peel force after the heat treatment at 270°C for 3 minutes of the release base material of 0.20-1.96 N/25 mm. The pressure-sensitive adhesive layer comprises an acrylic resin (A) having a weight average molecular weight of ≥1,000,000 and, if necessary, a tackifying resin (B), and a crosslinking agent (C), and the storage shear modulus at 270°C of the pressure-sensitive adhesive layer is preferably 0.3×105 to 3.0×105 Pa. Further, the acrylic resin (A) is preferably a copolymer obtained by copolymerizing 0.01-15 wt.% monomer (a) having a radically polymerizable unsaturated group and another reactive functional group, 50-99.99 wt.% (meth)acrylic ester monomer (b) other than the monomer (a), and 0-49.99 wt.% monomer (c) which is copolymerizable with the monomers (a) and (b) and other than the monomers (a) and (b).


Inventors:
UEDA YUKIHIRO
NAKAMURA MINORU
Application Number:
JP2003158328A
Publication Date:
December 24, 2004
Filing Date:
June 03, 2003
Export Citation:
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Assignee:
TOYO INK MFG CO
International Classes:
B32B27/00; C09J7/00; C09J133/00; C09J133/06; C09J201/00; (IPC1-7): C09J7/00; C09J133/00; C09J133/06; C09J201/00