Title:
PRESSURE-SENSITIVE ADHESIVE FOR MASKING AND ADHESIVE FILM COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP3154764
Kind Code:
B2
Abstract:
PURPOSE: To provide the subject adhesive capable of reliably preventing the infiltration of a treating solution into non-treating sections in the treatment of plating, etching and degreasing in an acidic or alkaline solution.
CONSTITUTION: The objective adhesive comprises 100 pts.wt. alkyl (meth)acrylate polymer with a weight-average molecular weight of 150,000-2,000,000 and 1-40 pts.wt. oil-soluble phenolic resin. The adhesive is crosslinked so as to set the gel ratio at 30-95% and the degree of swelling at 1.5-15 after immersion at 60°C for three days in a 10wt.% aqueous sodium hydroxide solution, as the degree of crosslinking of the alkyl (meth)acrylate polymer.
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Inventors:
Nagasaki, Kunio
Aizawa, Kaoru
Aizawa, Kaoru
Application Number:
JP27477291A
Publication Date:
April 09, 2001
Filing Date:
September 25, 1991
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/02; C09J133/04; C09J133/06; C09J133/10; C09J161/06; (IPC1-7): C09J133/06; C09J7/02; C09J161/06
Attorney, Agent or Firm:
祢▲ぎ▼元 邦夫