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Patent Searching and Data


Title:
PRESSURE-SENSITIVE ADHESIVE PAPER
Document Type and Number:
Japanese Patent JP2006182978
Kind Code:
A
Abstract:

To provide a pressure-sensitive adhesive paper having both low-temperature properties so that it can be suitably used even under a low-temperature atmosphere without impairing pressure-sensitive adhesive properties and printability so that printing can be adequately performed through use of an NIP printer.

The pressure-sensitive adhesive paper 1 comprises a pressure-sensitive adhesive layer 3 formed on one surface of a surface substrate 2. The surface substrate 2 is a sheet on which printing can be conducted through the use of a non-impact printer, a pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer 3 is composed of an acrylic ester, and the measured value on stress relaxation properties as measured in accordance with the method for measuring the holding power as described in JIS-Z0237 is in a range of 0.01-0.1 mm. The coating thickness of the pressure-sensitive adhesive is preferably in a range of 13-17 μm. The pressure-sensitive adhesive paper may be so prepared that an adhesive layer having both adhesiveness by press bonding and easy releasability is formed on the rear surface of the surface substrate 2 and a substrate formed of paper or a resin film is sandwiched between the adhesive layer and the pressure-sensitive adhesive layer.


Inventors:
NAGASAKA TAKAHIRO
OKADA MIO
Application Number:
JP2004380407A
Publication Date:
July 13, 2006
Filing Date:
December 28, 2004
Export Citation:
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Assignee:
DAIO SEISHI KK
International Classes:
C09J7/02; B42D11/00; C09J133/08; G09F3/10
Attorney, Agent or Firm:
Shiro Ogasawara