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Title:
PRESSURE-SENSITIVE ADHESIVE FOR PHARMACEUTICAL USE AND PHARMACEUTICAL PREPARATION PRODUCED THEREFROM
Document Type and Number:
Japanese Patent JPH05139961
Kind Code:
A
Abstract:

PURPOSE: To provide the subject adhesive composed of a specific pressure- sensitive adhesive structure coordinated with sugar, applicable to the skin without causing the rash and itchiness and having excellent safety, adhesiveness, feeling to the skin, water-absorption and compatibility to the skin.

CONSTITUTION: The objective adhesive contains preferably ≥5wt.%, especially 10-50wt.% of a pressure-sensitive adhesive structure containing a sugar having a molecular weight of ≥150 (e.g. glucose) coordinated to ≥1wt.% of the ester part of a copolymer containing one or more kinds of acrylic acid esters. The adhesive is preferably incorporated with 1-50wt.% of an agent such as hydrocortisone and formed on a flexible substrate to obtain a pharmaceutical preparation.


Inventors:
HOSAKA YOSHIFUMI
OTSUKA SABURO
KINOSHITA TAKASHI
Application Number:
JP32531891A
Publication Date:
June 08, 1993
Filing Date:
November 12, 1991
Export Citation:
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Assignee:
NITTO DENKO CORP
International Classes:
A61K9/70; A61L15/58; A61F13/02; (IPC1-7): A61F13/02; A61K9/70; A61L15/58
Attorney, Agent or Firm:
Kiyoharu Sawa



 
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