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Title:
Pressure sensitive adhesive sheet
Document Type and Number:
Japanese Patent JP5982593
Kind Code:
B2
Abstract:
Provided is a pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer that includes a resin part (X) containing a resin as a main component, and a particle part (Y) consisting of fine particles, at least a surface (±) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein plural concave portions having a maximum height difference of 0.5 µm or more exist in a prescribed region (P) on the surface (±), and 95% or more of the plural concave portions existing inside the region (P) have shapes differing from each other, and when the surface (±) of the resin layer is attached to a smooth surface of a light transmissive adherend having a smooth surface, the areal ratio of the attached area against the smooth surface of the light transmissive adherend to the surface (±) is 10 to 95%. When attached to an adherend, the pressure sensitive adhesive sheet can readily remove air accumulation to be formed and therefore exhibits excellent air escape property, and have good blister resistance and pressure sensitive adhesive characteristics.

Inventors:
Kazue Uemura
Koichiro Kato
Yumiko Amino
Saitou
Application Number:
JP2015563015A
Publication Date:
August 31, 2016
Filing Date:
April 02, 2015
Export Citation:
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Assignee:
LINTEC CORPORATION
International Classes:
C09J7/10; C09J11/04; C09J201/00
Domestic Patent References:
JP2012197332A2012-10-18
JP2008150431A2008-07-03
JP2002275433A2002-09-25
JP2004115766A2004-04-15
JP2012197332A2012-10-18
JP2008150431A2008-07-03
JP2002275433A2002-09-25
JP2004115766A2004-04-15
Foreign References:
WO2015152353A12015-10-08
WO2015152353A12015-10-08
Attorney, Agent or Firm:
Tamotsu Otani
Makoto Kataoka



 
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