Title:
PRESSURE-SENSITIVE ADHESIVE TAPE AND METHOD FOR USING THE PRESSURE-SENSITIVE TAPE
Document Type and Number:
Japanese Patent JP2011157479
Kind Code:
A
Abstract:
To provide a pressure-sensitive adhesive tape allowing stable use in a temperature environment higher than room temperature.
The pressure-sensitive adhesive tape 10 usable in a temperature environment of at least 90°C or higher includes a pressure-sensitive adhesive layer 12 and a release liner 14 provided on at least one surface of the pressure-sensitive adhesive layer 12. The release liner 14 comprises a base layer containing a polyolefin resin and a release layer that contains low-density polyethylene and is provided on at least one side of the base layer to be in contact with the pressure-sensitive adhesive layer 12.
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Inventors:
KOSAKA TOKUJU
NONAKA AKIKO
IGUCHI SHINJI
NONAKA AKIKO
IGUCHI SHINJI
Application Number:
JP2010020536A
Publication Date:
August 18, 2011
Filing Date:
February 01, 2010
Export Citation:
Assignee:
NITTO DENKO CORP
International Classes:
C09J7/00; B32B27/00; B32B27/32
Foreign References:
| WO2009144891A1 | 2009-12-03 |
Attorney, Agent or Firm:
Sakaki Morishita