To provide a pressure sensitive adhesive tape excellent in workability and of a good appearance, in which, when applied to an adherend, bubbles are readily removed to prevent failure outbreak derived from entrapped bubbles, even when uneven shapes of the adhesive layer are partly 400 μm or more, the appearance of the adhesive tape after applied does not deteriorate, and even if the adhesive tape after applied is subjected to a high temperature of 40-80°C, the trench pattern does not appear.
This pressure sensitive adhesive tape has an adhesive layer formed on at least one side of a resin film, wherein the adhesive layer has uneven shapes containing two or more slots arranged with given intervals on the surface to be adhered to the adherend, the arranged intervals of the slots are partly 400 μm or more, and a tensile modulus of the adhesive tape at a temperature between 23°C and 80°C ranges 30-600 MPa.
UKEI HIROICHI
MORIMOTO MASAKAZU
| JPH0598219A | 1993-04-20 | |||
| JP2001192629A | 2001-07-17 | |||
| JPH06220412A | 1994-08-09 | |||
| JPH09241442A | 1997-09-16 | |||
| JP2002544364A | 2002-12-24 | |||
| JP2003342533A | 2003-12-03 | |||
| JPH04239082A | 1992-08-26 |
Koichi Kajisaki
Yuzo Ozaki
Toshihiko Taniguchi
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