Title:
Pressure sensitive adhesive tape
Document Type and Number:
Japanese Patent JP6211771
Kind Code:
B2
Abstract:
The invention provides an adhesive tape that can be used as a cutting tape and uniformly expanded vertically and horizontally. The adhesive tape comprises an adhesive layer on a surface of a base material. Viewed from the base material, the dynamic friction of the surface of the outermost layer of the opposite side of the adhesive layer to a SUS430BA board is below 10.0N at temperature of 23 degrees centigrade and humidity of 50%.
Inventors:
Takuzo Yuto
Toshitaka Suzuki
Takahiro Yadakai
Toshitaka Suzuki
Takahiro Yadakai
Application Number:
JP2013022914A
Publication Date:
October 11, 2017
Filing Date:
February 08, 2013
Export Citation:
Assignee:
NITTO DENKO CORPORATION
International Classes:
C09J7/02; B32B27/00; B32B27/30; C09J133/00; H01L21/301
Domestic Patent References:
| JP2003158098A | ||||
| JP2009013183A | ||||
| JP2012191098A | ||||
| JP2007005436A | ||||
| JP2007335467A | ||||
| JP2009242586A | ||||
| JP11228924A |
Foreign References:
| WO2012042869A1 |
Attorney, Agent or Firm:
Katsuto Momii
Yoshida Masayasu
Yoshida Masayasu
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