To provide a pressure-sensitive body with superior pressure sensitivity based on a new principle, preferably a pressure-sensitive body capable of being used under a high temperature of 200C, and further, preferably a pressure sensitive element of high reliability capable of being used under a high pressure of 100 MPa or higher.
In this pressure-sensitive body in which second fine particles 12 are dispersed in the first fine particles, in a state of forming a conductive passage, a porosity of the pressure-sensitive body is 25% or higher and 55% or lower, and a contact state of the first fine particles 11 and the second fine particles 12, and mutual contact state of the second fine particles 12 by pressurization are changed, thus the electrical resistance of the pressure-sensitive body is changed.
JPH0821774 | SEMICONDUCTOR PRESSURE SENSOR AND ITS MANUFACTURE |
JPH0643054 | SENSOR |
JPS60153178 | WIRING METHOD FOR SENSE OF CONTACT FORCE SENSOR |
AKIHAMA KENJI
FUKUSHIMA HIDEKO
JP2007107963A | 2007-04-26 | |||
JPS5113238B1 | 1976-04-26 | |||
JP2002212605A | 2002-07-31 | |||
JP2006349656A | 2006-12-28 | |||
JPS5815210A | 1983-01-28 | |||
JP2005337818A | 2005-12-08 | |||
JP2004020355A | 2004-01-22 | |||
JP2004340731A | 2004-12-02 | |||
JP2005017076A | 2005-01-20 | |||
JP2006105964A | 2006-04-20 | |||
JP2002212605A | 2002-07-31 | |||
JP2007107963A | 2007-04-26 | |||
JPS5113238B1 | 1976-04-26 |