PRESSURE SENSOR CHIP

Japanese Patent JP2015166703

A

PROBLEM TO BE SOLVED: To reduce a stress generation due to constraint of a sensor diaphragm, and secure an expected withstand voltage by preventing a stress concentration toward a diaphragm edge, and also to suppress the maximum generation stress so as to achieve a higher withstand voltage.SOLUTION: A non-connection area SA is provided, which communicates with the peripheral part of a pressure introducing hole 11-2b in a part of a plane PL parallel to a pressure receiving surface of a sensor diaphragm 11-1 in the inside of a stopper member 11-2, and an annular groove 11-2d continuing to the non-connection area SA is provided. A cross-sectional shape of the groove 11-2d1 protruding to one side in the thickness direction of the stopper member 11-2 of this annular groove 11-2d (the side not facing the sensor diaphragm 11-1) is defined as at least a half-circular shape, and the cross-sectional shape of a groove 11-2d1 protruding to the other side (the side facing the sensor diaphragm 11-1) is defined as a semi-circle or less. With the cross-sectional shape of a groove 11-2d1 defined as a pressure introducing hole 11-2b side (inner side), the end parts of arcs facing each other are shifted. The cross-sectional shape of the groove 11-d may be a shape or the like in which an elliptical shape is shifted.

SETO YUKI

JP2014041266A

September 24, 2015

March 04, 2014

Click for automatic bibliography generation  

AZBIL CORP

G01L19/06; G01L13/00; H01L29/84

JP2013190343A	2013-09-26
JPH0344646U	1991-04-25
JPH01105840U	1989-07-17
JPS5740626A	1982-03-06

Masaki Yamakawa
Shigeki Yamakawa

Previous Patent: 六角板状酸化亜鉛粒子の製造方法

Next Patent: SURFACE STATE INSPECTION METHOD, AND MANUFACTURING METHOD AND IMPRINT METHOD OF IMPRINT MOLD