Title:
PRESSURE SENSOR CHIP
Document Type and Number:
Japanese Patent JP2015194342
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To achieve expected pressure resistance by reducing stress generation by restriction of a sensor diaphragm and preventing stress from concentrating on a diaphragm edge, and to ensure pressure resistance to pressure applied from the opposite side by making encapsulation of pressure transmission medium easier and eliminating influence of defective operations due to difference in transmission speed.SOLUTION: A non-junction region SA is provided in a stopper member 11-2 to lead to an area around a connecting hole 11-2b. A plurality of convex parts (columns) 12 are discretely formed on at least one of a first surface PL1 and a second surface PL2 opposed to the non-junction region SA, and a passage (groove) 13 between the convex parts 12 is formed to serve as a path connecting from the area around the connecting hole 11-2b and a circumferential edge part 14 of the non-junction region SA.
Inventors:
TOKUDA TOMOHISA
ISHIKURA YOSHIYUKI
ISHIKURA YOSHIYUKI
Application Number:
JP2014071064A
Publication Date:
November 05, 2015
Filing Date:
March 31, 2014
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L19/06
Domestic Patent References:
| JP2013190343A | 2013-09-26 | |||
| JPH0344646U | 1991-04-25 | |||
| JPH01105840U | 1989-07-17 | |||
| JPS5740626A | 1982-03-06 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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