To simplify assembly configuration in a pressure sensor device constituted by assembling a sensor element for detecting pressure on a circuit board.

This pressure sensor device is provided with the circuit board 10, the sensor element 20 for detecting pressure bonded on one face 11 of the circuit board 10, a bonding wire 30 for connecting the sensor element 20 with the circuit board 10 electrically, and a lid case 40 provided on one face 11 side of the circuit board 10 to cover the sensor element 20. The lid case 40 is bonded on one face 11 of the circuit board 10, a recessed part 41 is formed on a connection face with the circuit board 10 in the lid case 40, and the recessed part 41 is filled with adhesive 60.