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Title:
PRESSURE SENSOR DEVICE
Document Type and Number:
Japanese Patent JP3722037
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To simplify assembly configuration in a pressure sensor device constituted by assembling a sensor element for detecting pressure on a circuit board.
SOLUTION: This pressure sensor device is provided with the circuit board 10, the sensor element 20 for detecting pressure bonded on one face 11 of the circuit board 10, a bonding wire 30 for connecting the sensor element 20 with the circuit board 10 electrically, and a lid case 40 provided on one face 11 side of the circuit board 10 to cover the sensor element 20. The lid case 40 is bonded on one face 11 of the circuit board 10, a recessed part 41 is formed on a connection face with the circuit board 10 in the lid case 40, and the recessed part 41 is filled with adhesive 60.


Inventors:
Yuuhiro Araya
Yasuaki Makino
Application Number:
JP2001305563A
Publication Date:
November 30, 2005
Filing Date:
October 01, 2001
Export Citation:
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Assignee:
株式会社デンソー
International Classes:
G01L19/14; G01L13/06; G01L19/00; (IPC1-7): G01L19/14; G01L13/06; G01L19/00
Domestic Patent References:
JP2000206137A
JP2001124647A
JP8152374A
JP8271365A
JP5136309A
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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