To provide a pressure sensor in which damping is reduced by keeping sensitivity almost constant, and to provide a method for manufacturing it.
The pressure sensor 10 comprises a vibration plate 11a vibrates corresponding to variation of sound pressure by sound wave, a back plate 12 arranged while facing the vibration plate 11a through a gap 16, an electrode 17 provided on a semiconductor substrate 11, and an electrode 18 provided on the back plate 12. The back plate 12 comprises a plurality of through-holes 15. The through-hole 15 is constituted by a rectangular opening 15a formed on the lower surface of the back plate 12, a rectangular opening 15b formed on the upper surface of the back plate 12, and four tapered inner wall surfaces 15c spreading from the lower surface toward the upper surface. The opening 15a is set based on forms of a plurality of temporary openings 20 temporarily arranged like mesh so as to have a specified opening rate.
TAJIMA TOSHIFUMI
IGUCHI YOSHINORI
TAKESHI HIROSHI
MATSUSHITA ELECTRIC IND CO LTD
| JP2004356707A | 2004-12-16 | |||
| JP2004356708A | 2004-12-16 | |||
| JP2005260191A | 2005-09-22 | |||
| JP2002027595A | 2002-01-25 |