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Title:
PRESSURE SENSOR MANUFACTURING METHOD, PRESSURE SENSOR MANUFACTURING APPARATUS, AND PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2019109115
Kind Code:
A
Abstract:
To provide a pressure sensor manufacturing method for easily manufacturing a pressure sensor, a pressure sensor manufacturing apparatus, and a pressure sensor.SOLUTION: The pressure sensor manufacturing method uses an extruder provided with a tubular base 11, a mandrel 12 disposed in the base 11, an annular discharge port 14 held between the base 11 and the mandrel 12, and a plurality of spiral grooves 121 formed on an outer peripheral surface of the mandrel 12, in which the extruder feeds an elastic electrically conductive material from the inside of the mandrel 12 to two or more grooves 121 while extruding an elastic insulating material, thereby simultaneously extruding the elastic insulating material and the elastic electrically conductive material to form a pressure sensor 1 including a cylindrical body 2 defined in a hollow portion 2a along the longitudinal direction and made of the elastic insulating material, and two or more electric conductive ribs 31 made of the elastic electrically conductive material that are provided spirally along an inner peripheral surface 2b of the hollow portion 2a of the cylindrical body 2 to protrude inward from the inner peripheral surface 2b.SELECTED DRAWING: Figure 4

Inventors:
SUGITA KEISUKE
ABE MASAHIRO
Application Number:
JP2017241622A
Publication Date:
July 04, 2019
Filing Date:
December 18, 2017
Export Citation:
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Assignee:
HITACHI METALS LTD
International Classes:
G01L1/20; H01H11/00; H01H13/16
Domestic Patent References:
JPS588523B21983-02-16
JP2017062153A2017-03-30
JP2011514650A2011-05-06
JP2017052272A2017-03-16
JPH06344423A1994-12-20
JPH09218330A1997-08-19
JPH09254297A1997-09-30
JPH0724898A1995-01-27
JP2002527266A2002-08-27
Foreign References:
WO2015194030A12015-12-23
US20150328815A12015-11-19
US4484586A1984-11-27
WO1997001429A21997-01-16
US20110169513A12011-07-14
Attorney, Agent or Firm:
Hirata International Patent Office