Title:
PRESSURE SENSOR MODULE AND METHOD FOR MANUFACTURING PRESSURE SENSOR MODULE
Document Type and Number:
Japanese Patent JP2016133391
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensor module with which it is possible to fix a diaphragm to a base body without using welding.SOLUTION: The pressure sensor module comprises: a base body 14 having a first recess 22A in which a pressure sensor element 12 is fitted inside and a first receiving surface 30A extending from the opening edge of the first recess 22A to the outside; a first diaphragm 36A provided facing the first receiving surface 30A so as to close up the first recess 22A from an inlet side and disposed separably in the base body 14; a first elastic element 42A disposed on one side of the first diaphragm 36A outward from the opening edge of the first recess 22A; and a first mounting member 44A that is mounted on the base body 14 while the first diaphragm 36A and the first elastic element 42A are pressed toward the first receiving surface 30A.SELECTED DRAWING: Figure 3
Inventors:
KANEKO YASUAKI
OTA MASAKI
TSUDA HITOSHI
OTA MASAKI
TSUDA HITOSHI
Application Number:
JP2015008033A
Publication Date:
July 25, 2016
Filing Date:
January 19, 2015
Export Citation:
Assignee:
TGK CO LTD
International Classes:
G01L13/02
Attorney, Agent or Firm:
Sakaki Morishita
Yusuke Murata
Tomoyuki Miki
Yusuke Murata
Tomoyuki Miki