To shorten the time required for measuring the temperature characteristics of a pressure sensor chip by forming a hermetic joint between the side wall of a through hole and the outer circumference of a pressure introduction tube.

Pressure of a gas flowing into a hole of a pressure introduction tube 22, where a pressure sensor chip 23 is bonded to a base 21, is converted into an electric signal being outputted to an outer terminal 24b. More specifically, side wall of a through hole 1a made through the body 1 is bonded hermetically, at a joint 12, to the outer circumference of introduction tube 22 upon completion of a sensor element 2. Since the temperature characteristics of chip 23 are measured previously under unitary state of element having low thermal capacity, the time required for measuring the temperature characteristics can be shortened.