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Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2008008762
Kind Code:
A
Abstract:

To provide a pressure sensor which makes the same the sizes of thermal stresses applied on first and second pressure detection parts.

The pressure sensor S1 comprises: a case 10; first and second sensor chips 20 and 30 stored in the inside of the case 10; first and second pressure introduction holes 40 and 50 communicating with each of the first and second sensor chips 20 and 30; and a semiconductor circuit chip 60 for calculating a difference between the detection results of the first and second sensor chips 20 and 30. A plane layout of the case 10 mutually line-symmetrically arranges the first and second pressure introduction holes 40 and 50, and mutually line-symmetrically arranges the first and second sensor chips 20 and 30 by regarding a pressure partition wall as a reference.


Inventors:
UENO MASATO
Application Number:
JP2006179563A
Publication Date:
January 17, 2008
Filing Date:
June 29, 2006
Export Citation:
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Assignee:
DENSO CORP
International Classes:
G01L13/00; G01L19/14
Domestic Patent References:
JPH01269025A1989-10-26
JPS60219529A1985-11-02
JP2000028458A2000-01-28
JPH0727646A1995-01-31
JP2001174355A2001-06-29
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno



 
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