Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2014215064
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-accuracy pressure sensor capable of reducing a manufacturing cost.SOLUTION: A pressure sensor includes: a sensor chip 2 that has a diaphragm section 21 formed by etching a semiconductor substrate and detects pressure on the basis of distortion of the diaphragm part 21; a package 1 that has a box-shaped main body 11 housing the sensor chip 2 and a pressure introduction section 12 for introducing pressure to the main body 11; adhesive 3 that bonds an internal wall surface of the main body 11 and the sensor chip 2; a high moisture resistance resin 41 that coats the sensor chip 2 and a periphery of the adhesive 3; and a low moisture resistance resin 42 that has a lower moisture resistance than the high moisture resistance resin 41 and coats the periphery of the high moisture resistance resin 41.
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Inventors:
HACHIMAN NAOKI
Application Number:
JP2013090092A
Publication Date:
November 17, 2014
Filing Date:
April 23, 2013
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
G01L9/00; H01L29/84
Attorney, Agent or Firm:
Masakazu Ito
Wood Yasumune
Satoru Hosokawa
Takayoshi Matsumoto
Woods 太士
Wood Yasumune
Satoru Hosokawa
Takayoshi Matsumoto
Woods 太士