Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2017072384
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To further reduce thermal stresses from the outside propagating to a sensor chip than in a conventional one.SOLUTION: An annular corrugate 50c is formed at a position on the inner peripheral side from the connection part of a support diaphragm 50 with a package 10 and on the outer peripheral side from a pedestal plate 20 (21, 22) so as to enclose the periphery of the pedestal plate 20 (21, 22). For example, as the corrugate 50c, an annular and curved corrugate 50c1 is formed, with the cross section along the radial direction raised in shape of a mountain. Thus, the amount of displacement (amount of expansion/contraction) in an area of the support diaphragm 50 sandwiched between the package 10 and the pedestal plate 20 (21, 22) is increased, and thermal stresses from the outside that propagate to a sensor chip 30 are further reduced than in a conventional one.SELECTED DRAWING: Figure 1
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Inventors:
SEKINE MASASHI
ISHIHARA TAKUYA
SOEDA SUSUMU
TOCHIGI ISHIN
ISHIHARA TAKUYA
SOEDA SUSUMU
TOCHIGI ISHIN
Application Number:
JP2015197498A
Publication Date:
April 13, 2017
Filing Date:
October 05, 2015
Export Citation:
Assignee:
AZBIL CORP
International Classes:
G01L19/04; G01L9/12; G01L21/00
Domestic Patent References:
| JP2006003234A | 2006-01-05 | |||
| JP2011013190A | 2011-01-20 | |||
| JPH02196938A | 1990-08-03 | |||
| JP2008032451A | 2008-02-14 |
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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