Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2019143994
Kind Code:
A
Abstract:
To provide a temperature sensor integrated semiconductor pressure sensor capable of preventing damage of a temperature sensor due to a vibration by improving corrosion resistance in a connection part between a lead wire of the temperature sensor and a temperature sensor terminal.SOLUTION: A temperature sensor integrated semiconductor pressure sensor 100 is constituted by pre-molding a connection part 41 between a lead wire 42 and a temperature sensor terminal 11b with the use of a resin material 25 so as to reduce exposure of the lead wire 42, and then performing over-molding as a case 10.SELECTED DRAWING: Figure 1
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Inventors:
ANDO RYO
AKIYAMA YOSHIYUKI
HOSOKAWA TAKEO
AKIMOTO TAKANARI
KONUKI HIROSHI
AKIYAMA YOSHIYUKI
HOSOKAWA TAKEO
AKIMOTO TAKANARI
KONUKI HIROSHI
Application Number:
JP2018025644A
Publication Date:
August 29, 2019
Filing Date:
February 16, 2018
Export Citation:
Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD
International Classes:
G01L19/00; G01K1/10; G01L19/14
Attorney, Agent or Firm:
Yuji Toda