Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2928748
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To heighten the mechanical strength of a pressure sensor, lessen the number of parts, and simplify the manufacturing process of the sensor by unitedly composing a rotating substrate, a pressure introducing port, and a sensor chip.
SOLUTION: A positioning pin 15 formed in a pressure introducing port 11 is inserted to a positioning hole 7 of a rotating substrate 3a from the lower part and while a chip fixing part 17 of the pressure introducing port 11 being positioned at almost the center lower part of a hole part 5a of the rotating substrate 3a, the circuit substrate 3a and the pressure introducing port 11 are fixed mutually with an adhesive or by an another method. Further, a sensor chip 67 is fixed with an epoxy type adhesive and an electrode 75 formed on the sensor chip 67 and a substrate electrode 9 formed in the circuit substrate 3a are electrically connected by a wire bonding method.
Inventors:
MAKINO MITSUAKI
SUGYAMA HIROHIKO
SUGYAMA HIROHIKO
Application Number:
JP22743695A
Publication Date:
August 03, 1999
Filing Date:
August 12, 1995
Export Citation:
Assignee:
KOPARU DENSHI KK
International Classes:
G01L9/04; G01L9/00; G01L19/04; (IPC1-7): G01L9/04; G01L19/04
Domestic Patent References:
| JP61245036A | ||||
| JP5947838U |
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