Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3209120
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensor which can be downsized.
SOLUTION: A package body 1 having a recess 1a and a pressure introduction hole 1b formed on a bottom of the recess 1a is formed by using mold interconnection device(MID) molded substrate technology, and an electrode 1d is formed from a side wall upper face of the recess 1a toward an outer peripheral face of the package body 1 and toward a rear face of the package body 1. Then a sensor chip 3 is bonded to the bottom of the recess 1a via a glass base 4, and after an electrode 3b and the electrode 1d are wire-bonded via a wire 5, silicon resin 6 is applied on a surface of the sensor chip 3. Further a box-shaped metallic lid 7 comprising a barrier 7a is formed at an outer peripheral end, and the package body 1 and the metallic lid 7 are joined with each other so that a part formed with the recess 1a is covered by the lid 7, thereby manufacturing a pressure sensor.
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Inventors:
Sadayuki Kaku
Shigenari Takami
Shigenari Takami
Application Number:
JP28969496A
Publication Date:
September 17, 2001
Filing Date:
October 31, 1996
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS,LTD.
International Classes:
G01L9/04; G01L9/00; H01L29/84; (IPC1-7): G01L9/04; H01L29/84
Domestic Patent References:
| JP5997030A | ||||
| JP61184435A | ||||
| JP5346361A | ||||
| JP621482A | ||||
| JP7174654A | ||||
| JP5149815A | ||||
| JP7234244A | ||||
| JP255145U | ||||
| JP1131138U |
Attorney, Agent or Firm:
Junji Ando (1 person outside)
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