Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP3409109
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To improve durability against expansion and shrinkage of a component in a pressure sensor where a semiconductor pressure sensor body is mounted to a circuit substrate in a body case.
SOLUTION: A connection terminal 11 that projects from a package 5 of a semiconductor pressure sensor body 2 is connected to a circuit substrate 3 being fixed to a body case 1 (base case 1a, (cover case)), and at the same time a mounting part 6 that is provided along the package 5 is directly fixed to the body case 1 by heat caulking through an opening 7 that is formed at the circuit substrate 3. A pressure introduction part 12 that projects from a surface at a side in the direction where the sensor body of the package 5 is mounted is forced into a connection hole 16 that communicates with the pressure port of the body case 1 airtightly via a seal ring 18.
More Like This:
| WO/1991/010888 | FLUSH-MOUNTED PRESSURE SENSOR |
| JPS5516228 | CAPACITY TYPE SENSOR |
| JPH0342542 | CAPACITANCE TYPE PRESSURE SENSOR |
Inventors:
Izumi Kurose
Application Number:
JP29250996A
Publication Date:
May 26, 2003
Filing Date:
November 05, 1996
Export Citation:
Assignee:
Omron Corporation
International Classes:
G01L9/12; G01L9/00; G01L13/00; G01L19/14; (IPC1-7): G01L19/14; G01L9/00; G01L13/00
Domestic Patent References:
| JP552688A | ||||
| JP6255536A | ||||
| JP7120336A | ||||
| JP862076A | ||||
| JP843224A | ||||
| JP7225167A | ||||
| JP682323A | ||||
| JP618941U |
Attorney, Agent or Firm:
Kazuhide Okada