To provide a pressure sensor which can enhance a temperature characteristic, which is hardly affected by an external force and in which the connecting operation of a sensor chip to a printed-circuit board is performed easily.
A cylindrical pressure introduction pipe 7 is installed so as to protrude at the bottom face of a body 4. A cylindrical metal pipe 6 which comprises an outer flange 6a is fitted, fixed and bonded to a fitting hole 2a formed in a printed-circuit board 2 on which circuit components are mounted. A sensor chip 1 is bonded to one end part of the metal pipe 6, and it is connected to the printed-circuit board 2 by wire-bonding. The other end part of the metal pipe 6 is fitted to a recessed part 4a formed on the body 4, and it is fixed to the body 4 in a state that it communicates with the pressure introduction pipe 7. In this manner, since the sensor chip 1 is attached to and mounted on the metal pipe 6 whose coefficient of thermal expansion is close to that of silicon forming the sensor chip 1, the temperature characteristic of a pressure sensor is enhanced, and the sensor is hardly affected by an external force. In addition, the connection of the sensor chip 1 to the printed-circuit board 2 is performed easily.
KAJI NORIKIMI
IBARA NOBUYUKI
KODO MASAHIRO
SAITO HIROSHI
