To provide a small pressure sensor.

A package main body 1, which is provided with a recessed part 1a, for die bonding of a pressure sensor chip 3 using an MID molding substrate technique, and a pressure introducing hole 1b, is formed, and an electrode 1e is formed extending from the top surface of the side wall to the outer peripheral side surface and the rear surface of the recessed part 1a. And, using the MID molding substrate technique, a box-like lid body 7, having a barrier 7a at an outer peripheral end part, is formed, and an electrode 7b, which is electrically connected to the electrode 1e, is formed extending from the top surface of the barrier to the outer peripheral side surface and the rear surface of the lid body 7. To the place where the electrodes 1e and 7b are not formed out of the outer peripheral side surface of the package main body 1 and the lid body 7, gold plating is applied. Then the top surface of the barrier 7a is jointed to the top surface of the side wall of the recessed part 1a, and a void 8 is filled with an elastic conductive paste 9, so that the electrode 1e and the electrode 7b are electrically connected to each other.