PRESSURE WELDING PRETREATMENT DEVICE

Japanese Patent JP3806187

B2

PROBLEM TO BE SOLVED: To reduce a pressure welding pretreatment time.
SOLUTION: This device is provided with a cutting mechanism 4 cutting and forming a pressure welding surface at the end part of materials P, P' to be joined and a grinding mechanism 5 grinding and finishing the pressure welding surface of materials P, P'. The cutting mechanism 4 is arranged and mounted in the upstream side of a transfer line in a base 3 movable so as to advance and retard with respect to the transfer line transferring long sized materials P, P' in a given direction, and the polishing mechanism 5 is arranged and mounted in the downstream side of the transfer line in the same base. The grinding mechanism 5 is provided with an upstream side clamp 5A and a downstream side clamp 5B respectively clamping the material P' locating in the upstream side of the transfer line and the material P locating in the downstream side of the same, and a rotating brush 51 capable of regulating the position along the transfer line, reciprocating perpendicularly to the transfer line and rubbing and grinding the pressure welding surface of materials P, P' is provided between the upstream side clamp 5A and the downstream side 5B of the polishing mechanism 5.

Yoshida Hisa
Shinsuke Yoshizawa
Kenji Yatsushiro
Kikuchi Masayuki

JP20719996A

August 09, 2006

August 06, 1996

Click for automatic bibliography generation  

Shirayama Manufacturing Co., Ltd.

B21B15/00; B23K20/24; (IPC1-7): B23K20/24; //B21B15/00

JP4322889A
JP5034112B2
JP7227627A
JP8117812A
JP61162291A
JP8052508A
JP9295164A

Yoshiharu Yoshida

Previous Patent: FLUID CONTROL MECHANISM EQUIPPED HEAT STORAGE ENGINE

Next Patent: HUMAN AMNIOTIC CELL AND CELL FOR GENE THERAPY CONSISTING OF THE SAME