To provide a pressure welding tool for lead material bonding for IC chip, with which there is no substrate crack nor solder release.

Concerning the pressure welding tool in the structure bonding the main body of tool, which is constituted by performing the vapor-phase synthesization and deposition of polycrystal diamond film on the surface of substrate, to a shunk part with built-in heater while using a solder material, the substrate for the main body of this tool is composed of hard metal having the composition of inevitable impurity containing tungsten carbide in 90 to 98 wt.% as a dispersed phase forming component and Co as remaining bound phase forming component, besides, this solder material is composed of Cu alloy having the composition of Cu and inevitable impurity while containing Ag in 5 to 15 wt.% and P in 1 to 10 wt.% and further, the shunk part is composed of Ni alloy having the composition of Ni and inevitable impurity while containing Cr in 10 to 25 wt.% and Fe in 5 to 15 wt.%.