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Patent Searching and Data


Title:
PRESSURE-WELDING TYPE THYRISTOR MODULE
Document Type and Number:
Japanese Patent JPH06169563
Kind Code:
A
Abstract:

PURPOSE: To provide a safe pressure-welding thyristor module which has performance on a par with or higher than that of a conventional product in the property such as heat radiation property, insulation property, etc., and besides does not use noxious material.

CONSTITUTION: In a pressure-welding type thyristor module, where silicon binders 4 and 4, insulating substrates 10 and 10, and a heat radiation plate 1 are arranged in axial direction of a screw 2 for pressure welding and the said silicon binders 4 and 4 and insulating substrates 10 and 10 are brought into contact with each other in the direction of the heat radiation by the pressure of the screw 2 for pressure welding, each insulating substrate 10 and 10 is made of an aluminum nitride sintered body, and stress absorbing members 11a and 11b, which lighten the thermal stress working between each of the silicon binder 4, the heat radiating plate 1, and the insulating substrate 10, are made, respectively, on both sides of each insulating substrate 10 and 10.


Inventors:
HATORI MASAKAZU
Application Number:
JP32200192A
Publication Date:
June 14, 1994
Filing Date:
December 01, 1992
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01L21/52; H01L29/74; H02M1/00; (IPC1-7): H02M1/00; H01L21/52; H01L29/74
Attorney, Agent or Firm:
Hisano Hatano (1 person outside)