Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRESSURIZING AND COOLING TREATMENT METHOD OF HIGH PRECISION COMPONENT
Document Type and Number:
Japanese Patent JP2011021846
Kind Code:
A
Abstract:

To provide a pressurizing and cooling treatment method capable of preventing generation of a defective product in view of the fact that when pressurizing or cooling gas supplied to a treated object after vacuum heating treatment has been completed contains moisture, the moisture adheres to the treated object, and a defect occurs in the treated object.

A temperature and a steam pressure of the gas supplied from a gas supply source during pressurizing or cooling an inside of a treatment chamber 24 is adjusted by a dew point adjusting means 14, and the dew point in the treatment chamber 24 is adjusted to be equal to or at least slightly lower than the dew point of the gas in a dry clean room when the gas is introduced into the chamber 24.


Inventors:
KAWAHARA MASARU
Application Number:
JP2009168553A
Publication Date:
February 03, 2011
Filing Date:
July 17, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOSHIN ENGINEERING KK
International Classes:
F27D9/00; B01J19/00; F27B5/05; F27B5/16; F27D7/02
Domestic Patent References:
JPH08977A1996-01-09
JP2002256305A2002-09-11
JPH07188908A1995-07-25
JPH0867910A1996-03-12
Attorney, Agent or Firm:
Shinjiro Ono
Kazuo Shamoto
Yasushi Kobayashi
Akio Chiba
Hiroyuki Tomita
Toru Miyamae



 
Previous Patent: HEATING COOKER

Next Patent: HEAT EXCHANGER