Title:
PRETREATING SOLUTION FOR ELECTROLESS PLATING
Document Type and Number:
Japanese Patent JPS62156282
Kind Code:
A
Abstract:
PURPOSE: To carry out both degreasing and conditioning with the resulting titled pretreating soln. and to reduce the number of working stages by adding a silane coupling agent, a nonionic surfactant and EDTA.
CONSTITUTION: An aqueous soln. contg. a silane coupling agent such as CH2= CHSi(OC2H5)3, a nonionic surfactant such as polyoxyethylene lauryl ether and EDTA, a salt or deriv. thereof is prepd. as a pretreating soln. This pretreating soln. is especially suitable for use as a pretreating soln. for the electroless copper plating of a printed wiring board.
Inventors:
HIRAKAWA KIMIE
AKAZAWA SATOSHI
TAKITA TAKAO
OTSUKA YUKO
AYUBA KAZUYUKI
AKAZAWA SATOSHI
TAKITA TAKAO
OTSUKA YUKO
AYUBA KAZUYUKI
Application Number:
JP29931685A
Publication Date:
July 11, 1987
Filing Date:
December 27, 1985
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C23G1/24; C23C18/18; H01K3/18; H05K3/18; H05K3/38; (IPC1-7): C23C18/18; C23G1/24; H05K3/18
Attorney, Agent or Firm:
Kunihiko Wakabayashi