Title:
PRETREATMENT LIQUID FOR ELECTROLESS PLATING, AND ELECTROLESS PLATING METHOD
Document Type and Number:
Japanese Patent JP2016023323
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pretreatment liquid and an electroless plating method using the pretreatment liquid which are capable of forming a fine circuit on a non-conductive substance surface and forming a thin film in a wide range at uniform film thickness.SOLUTION: A pretreatment liquid for electroless plating consists of noble metal colloidal nanoparticles, sugar alcohol, and water, colloidal nanoparticles are any of gold (Au), platinum (Pt) and palladium (Pd), average particle diameter of colloidal nanoparticles is 5 to 80 nanometers, colloidal nanoparticles are contained in pretreatment liquid at 0.01 to 10 g/L as metal mass, sugar alcohol of at least one or more selected from the group consisting of threitol, tetritol, pentitol, hexitol, heptitol, octitol, inositol, quercitol, pentaerythritol is contained in pretreatment liquid at 0.01 to 200 g/L in total. Further, in an electroless plating method, electroless plating is performed in an electroless plating bath by using pretreatment agent.SELECTED DRAWING: Figure 1
Inventors:
ITO MASAHIRO
ADACHI YUICHI
ADACHI YUICHI
Application Number:
JP2014146991A
Publication Date:
February 08, 2016
Filing Date:
July 17, 2014
Export Citation:
Assignee:
ELECTROPLATING ENG
International Classes:
C23C18/18; C23C18/20
Attorney, Agent or Firm:
Satoru Miyazaki
Keiji Goto
Funakoshi Takuko
Keiji Goto
Funakoshi Takuko
Previous Patent: PRODUCTION METHOD OF ALUMINUM POROUS BODY
Next Patent: GAS SUPPLY DEVICE AND VALVE DEVICE
Next Patent: GAS SUPPLY DEVICE AND VALVE DEVICE