PURPOSE: To obtain satisfactory adhesion to plating by the radiation of ions for a short time when a metallic sheet is pretreated before plating, by subjecting the surface of the sheet to be plated to Ar ion sputtering under specified conditions related to ion current density, ion radiation time and the temp. of the surface to be plated.
CONSTITUTION: Before a metallic sheet is plated, the surface of the sheet to be plated is cleaned by Ar ion sputtering. This sputtering is carried out under conditions satisfying an inequality 5/T≤I×t≤10 [where T is 100W400°C temp. of the surface to be plated, I is ion current density (mA/cm2) on the surface to be plated and (t) is ion radiation time (sec)]. Thus, ion radiation time is considerably shortened and high-speed treatment applicable to the pretreatment of a coil before continuous plating is enabled.
SATO HIROSHI
TOYAMA MASAO
NISHIMOTO HIDETOSHI
IKEDA TSUGUMOTO
KAWAFUKU JIYUNJI
