To provide a preventing agent composition for the creeping-up of flux which has excellent heat resistance.
The preventing agent composition for the creeping-up of flux comprises a fluorine-containing resin with a fluorine ring-containing structure. The fluorine-containing resin has excellent heat resistance by comprising the fluorine ring-containing structure, and does not decompose even in a reflow temperature region when lead-free solder heated at 260 to 290°C is used. Further, the fluorine-containing resin is made amorphous by comprising the fluorine ring-containing structure, so that it has excellent transparency, and is made soluble in a fluorine based solvent. Thus, e.g., the preventing agent composition for the creeping-up of flux is applied to an electronic part, and drying is performed, so that a film of a preventing agent for the creeping-up of flux can easily be formed on the electronic part.
▲高▼木 芳之
Yoshinobu Hagino
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