To provide a printed board capable of mounting making the best use of features of die-pad exposure types and a mounting method for a surface-mounted semiconductor package using the same as to a technique for mounting a surface-mounted semiconductor package like QFN etc., of a die pad exposure type on a printed board.

The printed board 1 where the surface-mounted semiconductor package 3 having a connection terminal part 3b for electric connection and a die pad part 3a for heat radiation arranged on its bottom surface is mounted is constituted by forming a bonding pattern layer 1a to which the die pad part 3a is bonded on a surface of the printed board 1.