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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD, APPARATUS AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2008166350
Kind Code:
A
Abstract:

To simplify manufacturing steps of a printed circuit board, to suppress manufacturing cost of the printed circuit board and to connect wiring patterns without wire disconnection.

In the manufacturing steps of the printed circuit board, a copper surface plate 20 placed on a table 40 is heated by a heater 41 and is softened. A wire 70-1 is implanted to the softened copper surface plate 20 with downward movement of a clamper 60. The implanted wire 70-1 is cut away from a linear member 72-1 with a cutter 42. The copper surface plate 20 to which the linear member 72-1 is implanted is soaked into the plating liquid in a tank for electrolysis. The wiring patterns 22, 23 and the linear member 72-1 are electrically connected by conducting metal plating 24, 25 to the wiring patterns 22, 23 and the linear member 72-1.


Inventors:
YOSHIDA AKIO
Application Number:
JP2006351465A
Publication Date:
July 17, 2008
Filing Date:
December 27, 2006
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H05K1/11; H05K3/40
Attorney, Agent or Firm:
Kakimoto Yasunari