Title:
Printed circuit board coils with high current and low equivalent series resistance for power transfer applications
Document Type and Number:
Japanese Patent JP6351687
Kind Code:
B2
Abstract:
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer.
Inventors:
George Zabaco
Application Number:
JP2016214243A
Publication Date:
July 04, 2018
Filing Date:
November 01, 2016
Export Citation:
Assignee:
Huawei Technologies Company Limited
International Classes:
H01F38/14; H02J50/12; H05K1/16
Domestic Patent References:
| JP2008205215A | ||||
| JP2008172872A | ||||
| JP2011082212A | ||||
| JP2006173145A | ||||
| JP8097377A | ||||
| JP2004515056A | ||||
| JP2010258913A | ||||
| JP2011049492A | ||||
| JP2000022296A |
Foreign References:
| US20060125589 | ||||
| US20080164840 | ||||
| US20020075116 | ||||
| US5446311 |
Attorney, Agent or Firm:
Yoshifumi Saeki
Keiji Kiuchi
Keiji Kiuchi